现代制造工程 ›› 2017, Vol. 436 ›› Issue (1): 145-150.doi: 10.16731/j.cnki.1671-3133.2017.01.029

• 综述 • 上一篇    下一篇

再制造产品裂纹扩展行为的数值模拟研究现状

夏世琦1, 董丽虹2, 张彦华1, 陶博浩1, 郭伟2   

  1. 1 北京航空航天大学机械工程与自动化学院,北京 100191;
    2 装甲兵工程学院装备再制造技术国防科技重点实验室,北京 100072
  • 收稿日期:2015-05-10 出版日期:2017-01-20 发布日期:2018-01-10
  • 作者简介:董丽虹,通讯作者,副研究员,博士。E-mail:lihong.dong@126.com
  • 基金资助:
    国家973计划项目( 2011CB013401 )

Research progress in finite element simulation of crack propagation in remanufacturing products

Xia Shiqi1, Dong Lihong2, Zhang Yanhua1, Tao Bohao1, Guo Wei2   

  1. 1 School of Mechanical Engineering and Automation, Beihang University, Beijing 100191,China;
    2 National Key Laboratory for Remanufacturing, Academy of Armored Forces Engineering,Beijing 100072,China
  • Received:2015-05-10 Online:2017-01-20 Published:2018-01-10

摘要: 基体裂纹、涂敷层内部裂纹和涂敷层-基体界面裂纹是再制造产品中最常见的三种裂纹缺陷,这三种裂纹的存在对再制造产品寿命有重要影响。迄今,在服役条件下对上述三类裂纹的扩展行为及耦合作用的研究尚属空白。数值模拟技术的快速发展,为该问题的深入研究提供了有效的途径。综述了现阶段对基体裂纹、涂覆层内部裂纹,以及界面裂纹进行数值模拟的国内外研究进展,阐述了基于数值模拟技术研究再制造产品中三种裂纹相互影响机理及扩展行为的研究难点,并展望了该项研究未来的发展方向。

关键词: 再制造, 裂纹缺陷, 扩展行为, 数值模拟, 研究现状

Abstract: Remanufacturing technology with high quality, high efficiency, energy saving, material saving and environmental protection, it is becoming a new direction for the future development of green manufacturing industry. To the remanufacturing products, the blank crack, coating layer crack and interface crack are the most common crack defects. These crack defects have a great influence in the quality of remanufacturing products. The propagation and coupling effect of these crack defects in remanufacturing products is still unclear.The rapid development of numerical technology provide an effective way to research these problems. Details the research progress in finite element simulation of crack propagation, and points out the difficulties of appling the numerical simulation technology to the crack propagation research in remanufacturing products. Furthermore, the development direction of this kind of research is pointed out.

Key words: remanufacture, crack, propagation behaviour, simulation, research status

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